Product

Product

Product

Thermal Test Vehicle (TTV)

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a close up of a red wall with metal rivets
a close up of a red wall with metal rivets

High-Efficiency Thermal Management for AI, GPU & Data Centers- Cooling the Core of AI and HPC Innovation. Accelerate your AI and HPC performance with advanced thermal solutions designed for today’s most demanding systems. From AI servers and GPU clusters to immersion cooling and cold plates, our high-power thermal modules deliver precise heat simulation, intelligent protection, and seamless integration with next-gen cooling systems.

Type

Type

Type

Ultra-Thin Flexible Heaters

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a red room with a view of a city
a red room with a view of a city

Super High-Power TTV – Up to 500 W/cm² Simulate real AI chip and HPC thermal loads with ultra-high power density (500 W/cm²). Ideal for cold plates, heatsinks, and liquid/immersion cooling system testing.

a close up of a red wall with metal rivets

Engineered for accurate thermal control and reliable test results. Built-in temperature feedback protects your setup by pausing tests when cooling is insufficient.

a close up of a red wall with metal rivets

Engineered for accurate thermal control and reliable test results. Built-in temperature feedback protects your setup by pausing tests when cooling is insufficient.

a close up of a red wall with metal rivets

Engineered for accurate thermal control and reliable test results. Built-in temperature feedback protects your setup by pausing tests when cooling is insufficient.

Semiconductor Packaging & IC Design

Evaluate heat concentration, packaging materials’ thermal conductivity, and heat dissipation efficiency. Prevent chip overheating, validate high-density power designs, and ensure optimal IC performance.

Semiconductor Packaging & IC Design

Evaluate heat concentration, packaging materials’ thermal conductivity, and heat dissipation efficiency. Prevent chip overheating, validate high-density power designs, and ensure optimal IC performance.

Immersion Cooling & Liquid-Cooled Data Centers

Validate complete immersion cabinets, cold plates, pumps, and control modules, ensuring uniform heat extraction and system stability in high-density AI and HPC environments.

Immersion Cooling & Liquid-Cooled Data Centers

Validate complete immersion cabinets, cold plates, pumps, and control modules, ensuring uniform heat extraction and system stability in high-density AI and HPC environments.

CPU, GPU & AI Accelerator Testing (AMD, NVIDIA, AI Chips)

Simulate extreme thermal loads (up to 7,500 W per chip; roadmap up to 20,000 W) to prevent thermal throttling, optimize cooling, and ensure system reliability under peak power conditions.

CPU, GPU & AI Accelerator Testing (AMD, NVIDIA, AI Chips)

Simulate extreme thermal loads (up to 7,500 W per chip; roadmap up to 20,000 W) to prevent thermal throttling, optimize cooling, and ensure system reliability under peak power conditions.

CDU (Cooling Distribution Unit) & Cold Plate Manufacturers

Test multiple water-cooled chips for flow control, temperature management, and rapid heat dissipation. Verify cooling efficiency under multi-chip high-power operation.

CDU (Cooling Distribution Unit) & Cold Plate Manufacturers

Test multiple water-cooled chips for flow control, temperature management, and rapid heat dissipation. Verify cooling efficiency under multi-chip high-power operation.

Server & Rack Integrators

Optimize rack-level cooling performance by simulating combined heat loads (up to 300,000 W per cabinet) using TTE (Thermal Test Emulator) combined with multi-zone TTV modules.

Server & Rack Integrators

Optimize rack-level cooling performance by simulating combined heat loads (up to 300,000 W per cabinet) using TTE (Thermal Test Emulator) combined with multi-zone TTV modules.

AI & HPC Thermal Performance Validation

Ensure AI servers, GPU clusters, and OAM modules maintain safe operating temperatures (<80°C) under extreme workloads, accelerating product development and deployment.

AI & HPC Thermal Performance Validation

Ensure AI servers, GPU clusters, and OAM modules maintain safe operating temperatures (<80°C) under extreme workloads, accelerating product development and deployment.

GPU Heatsink & Cold Plate Verification

Use single-zone and multi-zone TTVs to emulate hot spots across chips, supporting precise validation for heatsinks, vapor chambers, and liquid-cooled cold plates.

GPU Heatsink & Cold Plate Verification

Use single-zone and multi-zone TTVs to emulate hot spots across chips, supporting precise validation for heatsinks, vapor chambers, and liquid-cooled cold plates.

a red room with a view of a city
a red room with a view of a city
a red room with a view of a city
a red room with a view of a city
a red room with a view of a city
a red room with a view of a city
a close up of a red wall with metal rivets

Server rack thermal management and cooling system testing

a close up of a red wall with metal rivets

Server rack thermal management and cooling system testing

a close up of a red wall with metal rivets

Server rack thermal management and cooling system testing

a close up of a red wall with metal rivets

OAM cold plate cooling test

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OAM cold plate cooling test

a close up of a red wall with metal rivets

OAM cold plate cooling test

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Heat dissipation test of cooling components

a close up of a red wall with metal rivets

Heat dissipation test of cooling components

a close up of a red wall with metal rivets

Heat dissipation test of cooling components

a close up of a red wall with metal rivets

Heatsink heat dissipation test

a close up of a red wall with metal rivets

Heatsink heat dissipation test

a close up of a red wall with metal rivets

Heatsink heat dissipation test

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sales@thermovex.com

sales@thermovex.com

sales@thermovex.com