Product
Thermal Test Vehicle (TTV)
High-Efficiency Thermal Management for AI, GPU & Data Centers- Cooling the Core of AI and HPC Innovation. Accelerate your AI and HPC performance with advanced thermal solutions designed for today’s most demanding systems. From AI servers and GPU clusters to immersion cooling and cold plates, our high-power thermal modules deliver precise heat simulation, intelligent protection, and seamless integration with next-gen cooling systems.
Thermal Test Vehicle
Features
Super High-Power TTV – Up to 500 W/cm² Simulate real AI chip and HPC thermal loads with ultra-high power density (500 W/cm²). Ideal for cold plates, heatsinks, and liquid/immersion cooling system testing.
Semiconductor Packaging & IC Design
Evaluate heat concentration, packaging materials’ thermal conductivity, and heat dissipation efficiency. Prevent chip overheating, validate high-density power designs, and ensure optimal IC performance.
Immersion Cooling & Liquid-Cooled Data Centers
Validate complete immersion cabinets, cold plates, pumps, and control modules, ensuring uniform heat extraction and system stability in high-density AI and HPC environments.
CPU, GPU & AI Accelerator Testing (AMD, NVIDIA, AI Chips)
Simulate extreme thermal loads (up to 7,500 W per chip; roadmap up to 20,000 W) to prevent thermal throttling, optimize cooling, and ensure system reliability under peak power conditions.
CDU (Cooling Distribution Unit) & Cold Plate Manufacturers
Test multiple water-cooled chips for flow control, temperature management, and rapid heat dissipation. Verify cooling efficiency under multi-chip high-power operation.
Server & Rack Integrators
Optimize rack-level cooling performance by simulating combined heat loads (up to 300,000 W per cabinet) using TTE (Thermal Test Emulator) combined with multi-zone TTV modules.
AI & HPC Thermal Performance Validation
Ensure AI servers, GPU clusters, and OAM modules maintain safe operating temperatures (<80°C) under extreme workloads, accelerating product development and deployment.
GPU Heatsink & Cold Plate Verification
Use single-zone and multi-zone TTVs to emulate hot spots across chips, supporting precise validation for heatsinks, vapor chambers, and liquid-cooled cold plates.
Multi-Zone Power TTV
Multi-Zone Power TTV
Heat dissipation test of cooling components
Heatsink heat dissipation test
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